3D Inline Automated Solder Paste Inspection
Full view 3D images with high precision data
Mirage series show paste defects in real-time by the whole board view in 3D
The JUTZE Mirage is an inline 3D solder paste inspection machine that checks every board as it leaves the printer, before a single component is placed. Two digital fringe projectors and a 5M or 12M industrial camera scan the whole panel, and the software compares what it sees against the deposit your process is supposed to produce. Operators read the outcome on a full-board 3D view rather than a single camera frame, so a thin deposit in one corner or an extra blob beside a fine-pitch pad is visible at a glance. The series covers two models: the Mirage for single-lane lines and the Mirage-D, which adds a dual-lane option for wider boards. Both mount on the conveyor, load and unload boards automatically, and work the same way from the operator's side of the machine.
| Item | Mirage | Mirage-D |
|---|---|---|
| Machine size (W × D × H) | 1080 × 1300 × 1850 mm | 1160 × 1470 × 1875 mm |
| Weight | 777 kg | 950 kg |
| PCB size, single lane | 50 × 70 mm to 510 × 460 mm | 50 × 70 mm to 510 × 590 mm |
| PCB size, dual lane | Not available | 50 × 70 mm to 510 × 330 mm per lane |
| PCB thickness | 0.6–6.0 mm | 0.6–6.0 mm |
| Warpage compensation | 3 mm | 3 mm |
| 3D projector | Two-direction digital fringe projector | Two-direction digital fringe projector |
| Vision system | 5M / 12M industrial high-speed camera | 5M / 12M industrial high-speed camera |
| Inspection data | 2D + 3D image analysis | 2D + 3D image analysis |
| Inspection speed | 350 ms per FOV (2D + 3D) | 350 ms per FOV (2D + 3D) |
| Conveyor and interface | Automatic load and unload, bottom-up clamping, automatic rail width adjustment, SMEMA | Same |
| Rail height | 900 ± 20 mm | 900 ± 20 mm |
| Power, air and environment | AC 220 V, 50/60 Hz, 1.8 kVA; 0.5 MPa; 5–40 °C, 25–80% RH | Same |
On high-volume consumer device boards the system works straight after the printer, where a small drift in paste volume is enough to pull yield down over a shift. Automotive and industrial control boards use the same place in the line for a different reason: a bridge or an over-deposit in a power section is expensive to find late, and the 3D record gives the quality team something concrete to review against the print program. Contract manufacturers with frequent changeovers get most value from stored inspection programs, since a product is taught once and then recalled by name on the next run. The machine also earns its place during first-article checks, when a new stencil or a fresh squeegee is proven before the line commits to a full batch. Plants where equipment from several pick and place machine manufacturers shares one floor run the same inspection standard on every line, so paste quality stays comparable between shifts.
ZJ-SMT supplies Panasonic SMT and PCB assembly equipment and spare parts to manufacturers worldwide. Our range covers pick-and-place machines, axial and radial insertion equipment, solder paste inspection systems, and feeder spare parts, with both new and used options available. We support bulk orders, and machine condition and availability are confirmed with you before ordering. Whether you are expanding a line, replacing a worn feeder part, or sourcing equipment for a new project, send us your model numbers and our team will come back with a suitable solution and quotation.
Two digital fringe projectors light the paste from different directions and a high-speed camera captures the result, then the software combines the 2D image with measured height to build a 3D map of every deposit. That is why the system reports volume and shape instead of a flat silhouette, and why shadow-free lighting matters on tall or closely spaced pads.
They do different jobs, so most lines keep both. The check after soldering reads joints, while this system reads the paste immediately after printing. Catching a printing fault at the printer means the board is cleaned and re-printed instead of being carried through placement and soldering and then reworked.
Faults appear on screen in real time as the board is scanned, so a drift in paste volume is visible while the panel is still at the printer. Printing parameters are adjusted and the board is re-printed long before the panel would have reached the reflow oven, which keeps one bad print from turning into a batch of rework.
Yes. The system inspects the paste your existing printer produces, so stencils, squeegees and print parameters stay as they are, and it connects inline through the standard SMEMA handshake. Downstream placement is unaffected, whether the line carries one brand or equipment from several SMT pick and place machine manufacturers.
It is stopped before anything is placed on it. The operator sees the marked defect on the board view, wipes the print and runs the board again, so the fault never reaches the SMT components that would otherwise be mounted on a bad deposit. Boards that pass continue straight through to placement without extra handling.
Day-to-day care is mostly cleanliness: keep the projector windows and camera lenses free of paste dust, and keep the conveyor rails clear so boards sit flat at the clamping point. Beyond that, follow the calibration and verification interval that suits your quality system, and our engineers can advise on a schedule for your production volume.
